Publications

Journal Publications

Song, W; Krishnaswamy, V; and Pucha, R.V. “Computational Homogenization in RVE Models with Material Periodic Conditions for CNT Polymer Composites”, Composite Structures, 2016, vol. 137 (17), pp. 9-17.View

Bhuiyan, M. A., Pucha, R. V., and Kalaitzidou, K. 3D RVE models able to capture and quantify the dispersion, agglomeration and orientation state of CNT in CNT/PP nanocomposites, Frontiers in Materials (Composite Materials), Vol.3, 2016, pp.1-12. View

Pucha, R.V., and Worthy, J., “RVE-based design and analysis tools for composite materials with nanofillers”, Journal of Composite Materials, Vol. 48(17), 2014, pp. 2117-2129. View

Liu,R., Melkote, S.,  Pucha, R.V.,  Morehouse, J.,  Man, X.,  Marusich, T., An enhanced constitutive material model for machining of Ti–6Al–4V alloy, Journal of Materials Processing Technology, Vol. 213 (12), 2013, pp. 2238-2246. View

Bhuiyan, M.A., Pucha, R.V., Worthy, J., Karevan, M., Kalaitzidou, K.,”Understanding the effect of CNT characteristics on the tensile modulus of CNT reinforced polypropylene using finite element analysis”, Computational Materials Science, 79(11), 2013, pp. 368 – 376. View

Bhuiyan, M.A., Pucha, R.V., Worthy, J., Karevan, M., Kalaitzidou, K.,”Defining the lower and upper limit of the effective modulus of CNT reinforced polypropylene composites through integration of modeling and experiments”, Composite Structures, 95(1), 2013, pp.80-87. View

Bhuiyan, M.A., Pucha, R.V., Karevan, M., Kalaitzidou, K.,” Tensile Modulus of Carbon Nanotube / Polypropylene Composites – A Computational Study Based on Experimental Characterization”, Computational Materials Science , Vol. 50(8), 2011, pp. 2347 – 2353. View

Karevan, M., Pucha, R.V., Bhuiyan, M.A., Kalaitzidou, K., “Effect of Interphase Modulus and Nanofiller Agglomeration on the Tensile Modulus of Graphite Nanoplatelets and Carbon Nanotube Reinforced Polypropylene Nanocomposites”, Carbon Letters, Vol. 11(4), 2010, pp. 325-331. View

Pucha, R.V., and Krishna Murty, A.V., “A High Precision Coupled Bending – Extension Triangular Finite Element for Laminated Plates,” Computers & Structures, Vol. 72(6), 1999, pp. 763-777. View

Pucha, R.V.,, Harikumar, H.K. and Krishna Murty, A.V., “A High Precision Thickness – stretch Deformation Element,” Mechanics of Composite Materials and Structures, 2(3), 1995, pp.181-202. View

Govindarajan, R., Krishna Murty, A.V., Vijayakumar, K. and Pucha, R.V., “Finite Element Estimation of Elastic Interlaminar Stresses in Laminates,” Composites Engineering, 3(5), 1993, pp. 451-466. View

Zavattieri, P.D., Pucha, R.V., and Espinosa, H.D., “Computational Model of Ceramic Microstructures Subjected to Multi-Axial Dynamic Loading,” Journal of the Mechanics and Physics of Solids, 49(1), 2001, pp. 27-68. View

[Article] Kumbhat, N., Raj, P.M., Pucha, R.V., Sundaram, V., Bongio, E., Sitaraman, S., Tummala, R., “A Novel Low CTE, High Stiffness Ceramic Composite Core,” Circuits Assembly, January 2007.

Kumbhat, N., Raj, P.M., Pucha, R.V., Tsai, J., Atmur, S., Bongio, E., Sitaraman, S.K. and Tummala, R., “Novel Ceramic Composite Substrate Materials for High-Density and High Reliability Packaging,” IEEE Transactions on Advanced Packaging, Vol.30 (4), 2007, pp 641-653.

[Book Chapter] Kumbhat, N., Markondeya Raj, P., Hegde, S., Pucha, R.V., Sundaram, V., Hayes, S., Atmur, S., Bhattacharya, S., Sitaraman, S.K., and Tummala, R.R., “Novel Board Material Technology for Next-Generation Microelectronic Packaging,” in Developments in Dielectric Materials and Electronic Devices, Ceramic Transactions,18(21), 2004, pp. 371-382.

[Book Chapter] Pucha, R.V., Sitaraman, S.K., Hegde, S., Damani, M., Wong, C.P., Qu, J., Zhang, Z., Raj, P.M., and Tummala, R.R., “Materials and Mechanics Challenges in SOP-Based Convergent Microsystems,” Micromaterials and Nanomaterials, Vol. 3, 2004, pp.16-29.

Hegde, S., Pucha, R.V., and Sitaraman, S.K., “Enhanced Reliability of High-Density Wiring (HDW) Substrates Through New Base Substrate and Dielectric Materials,” Journal of Materials Science: Materials in Electronics, 15(5), 2004, pp. 287-296.

Pucha, R.V., Ramakrishna, G., Mahalingam, S. and Sitaraman, S.K., “Modeling Spatial Strain Gradient Effects in Thermo-Mechanical Fatigue of Copper Micro-Structures,” International Journal of Fatigue, Vol. 26(9), 2004, pp. 947-957. View

Pucha, R.V., Tunga, K., Pyland, J. and Sitaraman, S.K., “Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment,” Transactions of the ASME – Journal of Electronic Packaging, 126(2), 2004, pp. 256-264.

Pucha, R.V., Hegde, S., Damani, M., Tunga, K., Perkins, A., Mahalingam, S., Ramakrishna, G., Lo, G., Klein, K., Ahmad, J., and Sitaraman, S.K., “System-level Reliability Assessment of Mixed-signal Convergent Microsystems,” IEEE Transactions on Advanced Packaging, Vol. 27(2), 2004, pp. 438-452.

Pyland, J., Pucha, R.V. and Sitaraman, S.K., “Thermo-mechanical Reliability of Underfilled BGA packages,” IEEE Transactions on Electronics Packaging Manufacturing, Vol. 25(2), 2002, pp.100-106.

Pucha, R.V., Pyland, J. and Sitaraman, S.K., “Damage Metric-Based Mapping Approaches for Developing Accelerated Thermal Cycling Guidelines for Electronic Packages,” International Journal of Damage Mechanics,10 (3), 2001, pp. 214-234.

[Article] Tummala, R.R., Sundaram V., Raj, P.M., Pucha, R.V., Bandopadhay, T., Kumbhat, N., Sridharan, V., Walden-Monroe, T., and Sutter, D., 2010, “Georgia Tech’s Vision for Ultra-miniaturized Device and Systems Packaging”, Chip Scale Review, July/August 2010, pp. 14-18.

[Book Chapter] Pucha, R.V., Qu, J., and Sitaraman, S.K., 2008, “Mixed-Signal Package Reliability” in “Introduction to System-on-Package (SOP),” Editors, Tummala, R.R., and Swaminathan, M., Published by McGraw-Hill, NY, 443-487.

Kim, I., Pucha, R.V., Peak, R.S., and Sitaraman, S.K., “Development of Reliability Allocation and Assessment Algorithms for Designing Multilevel Microelectronic Systems”, Journal of Microelectronics and Electronic Packaging, 5(1), 2008, pp 12-25.

Lee, K.J., Damani, M., Pucha, R.V., Bhattacharya, S.K., Tummala, R.R., and Sitaraman, S.K., “Reliability Modeling and Assessment of Embedded Capacitors in Organic Substrates,” IEEETransactions on Components and Packaging Technologies, 30(1), 2007, pp.152-162.

Varadarajan, M.G., Lee, K.J., Bhattacharya, S.K., Pucha, R.V., Tummala, R.R., and Sitaraman, S.K., “Printed Circuit Board (PCB) Miniaturization by Embedded Passives and Sequential Build-Up (SBU) Process Methodology,” Journal of Indian Institute of Science, Vol. 86, 2006, pp. 639-654.

Referred Conference Proceedings

Demir, K.; Armutlulu, A.; Tong, J.; Pucha, R.V.; Sundaram, V.; Tummala, R., First Demonstration of Reliable Copper-Plated 30μm Diameter Through-Package-Vias in Ultra-Thin Bare Glass Interposers, of Electronic Components and Technology Conference (ECTC), 2014, pp. 1098-1102.

Demir, K.; Ramachandran, K.; Sato, Y.; Qiao Chen; Sukumaran, V.; Pucha, R.; Sundaram, V.; Tummala, R., Thermo-mechanical and electrochemical reliability of fine-pitch through-package-copper vias (TPV) in thin glass interposers and packages, of Electronic Components and Technology Conference (ECTC), 2013, pp. 353-359.

Bhuiyan, M.A., Pucha, R.V.,  Kalaitzidou, K.,  “Characterization of CNT orientation and Diameter distribution in CNT/polymer composites by image analysis”, Proceedings of the SPE-ANTEC conference, Ohio, April 22-24, 2013.

Bhuiyan, M.A., Pucha, R.V., Karevan, M., Kalaitzidou, K.,” Quantifying the effect of CNT agglomeration, orientation and waviness on the tensile modulus of CNT/Polypropylene composites”, Proceedings of the International conference of Mechanics of Nano, Micro and Macro Composite Structures, Politecnico di Torino, 18-20 June 2012.

Bhuiyan, M.A., Pucha, R.V., Karevan, M., Kalaitzidou, K.,” Modeling the Effect of Filler-Matrix Contact and Filler Agglomeration on Effective Modulus of Polymer Nano-composites”, Proceedings of ANTEC conference, Boston, May 1-5, 2011.

Krishnan, G., Liu, F., Sundaram, V., Pucha, R,V., Tummala, R.,”High Performance Organic Dielectrics and High Density Substrates for Next Generation System on a Package (SOP) Technology”, Proceedings of the 58th Electronic Components and Technology Conference, 2008, pp. 2101-2104.

Kumbhat, N., Raj, P.M., Pucha R.V., Doraiswami, R., Sunadaram, V., Bhattacharya, Sitaraman, S.K. and Tummala, R., “Recent Advances in Composite Substrate Materials for High-Density and High Reliability Packaging Applications,” Proceedings of the 55th Electronic Components and Technology Conference, 2005, pp. 1364-1372.

Kumbhat, N., Hegde, S., Raj, P.M., Pucha R.V., Doraiswami, R., Hayes, S., Atmur, S., Bhattacharya, S., Sitaraman, S.K., Tummala, R.R. “Novel Board Material Technology for Next-generation Packaging,” Proceedings of the 9th International Symposium and Exhibition on Advanced Packaging Materials, 2004, pp. 247-252.

Mahalingam, S., Hegde, S., Ahmad, J., Pucha R.V., Sundaram, V., Liu, F., Tummala, R. and Sitaraman, S.K., “Materials, Process and Reliability of Mixed-signal Substrates for SOP Technology,” Proceedings of the 54th Electronic Components and Technology Conference, 2004, pp. 1630-1635.

Kumbhat, N., Raj, P.M., Pucha R.V., Sunadaram, V., Doraiswami, R., Bhattacharya, S., Hayes, S., Atmur, S., Sitaraman, S.K., Tummala, R. “Next Generation of Package/board Materials Technology for ultra-high Density Wiring and Fine-pitch Reliable Interconnection Assembly,” Proceedings of the 54th Electronic Components and Technology Conference, 2004, pp. 1843-1850.

Mahalingam, S., Hegde, S., Pucha, R.V., and Sitaraman, S.K., “Material Interaction Effects in the Reliability of High Density Interconnect (HDI) Boards,” Proceedings of the ASME International Mechanical Engineering Congress and Exposition, 2003, Washington, D.C, USA. IMECE2003/EPP-41645.

Hegde, S., Pucha, R.V. and Sitaraman, S.K., “Selection of Optimal Materials and Geometry for Reliability of High Density Wiring (HDW) Substrates,” Proceedings of the 52nd Electronic Components & Technology Conference, 2002, pp. 446-451.

Hegde, S., Pucha, R.V., Takahashi, A., Takano, N., Sitaraman, S.K., “Thermo-mechanical Reliability of High Density Wiring Substrates,” Proceedings of the 8th  Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002, pp. 919 -925.

Hegde, S., Pucha, R.V., and Sitaraman, S.K. “Enhanced Reliability of High Density Wiring (HDW) Substrates Through New Dielectric and Base Substrate Materials,” Proceedings of the ASME International Mechanical Engineering Congress and Exposition, November 17-22, New Orleans, USA. IMECE2002/EPP-39671.

Raghuram, P.V., Pradeep Reddy, G. and Krishna Murty, A.V.(Published with First Name) “Modeling of Damage in Laminates. Aerospace Composites – Challenges and Opportunities,” Proceedings of the Composites – 1994, Vol. I, pp. 138-151.

Krishna Murty, A.V., Vijayakumar, K., Govindarajan, R., and Raghuram, P.V. (Published with First Name) “Interlaminar Stress Estimation in Laminates Through Finite Elements,” Proceedings of the 22nd  Mid Western Mechanics Conference, 1991, Missouri – Rolla, Vol. 16, pp. 323.

Chen, Q., Bandyopadhyay, T., Liu, F., Sundaram, V.,  Pucha, R.V.,  Sukumaran,V.,  Nitesh, K., Swaminathan, M.,  and Tummala, R., “Design and Demonstration of Low Cost, Panel-based Polycrystalline Silicon Interposer with Through-Package-Vias (TPVs)”, Proceedings of the 61st  Electronic Components and Technology Conference, 2011, pp 855-860.

Sukumaran, V., Bandyopadhyay, T.,  Chen, Q.,  Kumbhat, N.,  Liu, F.,  and Pucha, R.V., Sato, Y., Watanabe, M., Kitaoka, K., Ono, M., Suzuki, Y., Karoui, C.,  and Nopper, C. “ Design, Fabrication and Characterization of Low-Cost Glass Interposers with Fine-Pitch Through-Package-Vias”, Proceedings of the 61st  Electronic Components and Technology Conference, 2011, pp 583-588.

Mishra, D., Raj, P.M.., Khan, S.,  Kumbhat, N.,  Wang, Y., Addya, S.,  Pucha, R.V.,  Choudhury, A., Sundaram, V.,  and Tummala, R.,  “Co-W As an Advanced Barrier for Intermetallics and Electromigration in Fine- Pitch Flipchip Interconnections”, Proceedings of the 61st  Electronic Components and Technology Conference, 2011, pp 916-920.

Kim, I., Pucha, R.V., Peak, R.S., and Sitaraman, S.K, “System Design-for-Reliability Tools for Highly Integrated Electronic Packaging Systems”, Proceedings of the 57th Electronic Components & Technology Conference, 2007, pp. 1809-1814.

Varadarajan, M., Lee, K.J., Bhattacharya, S.K., Bhattacharjee, A., Wan, L,  Pucha, R.V., Tummala, R., Sitaraman, S.,  “Studies on Design, Fabrication and Reliability Assessment of Embedded Passives on a High-Density Interconnect (HDI) Organic substrate using a sequential build-up process”, Proceedings of the IEEE-CPMT HDP06 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, June 27-30, 2006, Shanghai, pp 188-198.

Zheng, J., Klein, K.,  Pucha, R.V.,  Sitaraman, S.V.,  Merlin, D.,  Rajalakshmi, S., Sarma, D.S.R.,  Gerwirtz, A.,  and Sitaraman, S.K, “Nano-Cantilevers for an Ultra-Sensitive Bio-Assay”, Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show, 2005, Vol.1, pp. 402-405.

Lee, K., Pucha, R.V., Varadarajan, M., Bhattacharya, S., Sitaraman, S.,  Tummala, R.,  “Reliability assessment of embedded capacitors in multi-layered microvia organic substrates”, Proceedings of the IMAPS International Symposium on Microelectronics, Philadelphia, September 2005, pp 98-104.

Sundaram, V., Tummala, R., White, G., Lim, K., Wan, L., Guidotti, D., Liu, F., Bhattacharya, S., Raj, P.M., Abothu, I.R., Doraiswami, R., Pucha, R.V., Laskar, J., Tentzeris,M., Chang, G.K., Swaminathan, M. “System-on-a-Package (SOP) Substrate and Module with Digital, RF, and Optical Integration,” Proceedings of the 54th Electronic Components and Technology Conference, 2004, pp. 17-23.

Damani, M., Pucha, R.V., Bhattacharya, S., Tummala, R., and Sitaraman, S.K. “Thermo-mechanical and System Reliability of RF Integral Passives,” Proceedings of the 54th Electronic Components and Technology Conference, 2004, pp. 2027-2031.

Tunga, K., Kacker, Pucha, R.V., and Sitaraman, S.K., “Accelerated Thermal Cycling: Is it Different for Lead-Free Solder?” Proceedings of the 54th Electronic Components and Technology Conference, 2004, 1579-1585.

Hegde, S., Pucha, R.V., Guidotti, D., Liu, F., Tummala, R., and Sitaraman, S.K., “Design, Fabrication, and Reliability Testing of Embedded Optical Interconnects on Board,” Proceedings of the 54th Electronic Components and Technology Conference, 2004, pp. 895-900.

Sundaram, V., Tummala, R., White, G., Lim, K., Wan, L., Guidotti, D., Liu, F., Bhattacharya, S., Raj, P.M., Abothu, I.R., Doraiswami, R., Pucha, R.V., Sitaraman, S., Laskar, J., Tentzeris,M., Chang, G.K., and Swaminathan, M., “First Single Module Demonstration of SOP with Digital, Optical and RF for Last Mile Broadband Applications,” Proceedings of the International Conference on Electronics Packaging, Japan, 2004,  399-404.

Tunga, K., Pyland, J., Pucha, R.V., and Sitaraman, S.K., “Field-use Conditions vs. Thermal Cycles, a Physics-based Mapping Study,” Proceedings of the 53rd Electronic Components and Technology Conference, 2003, pp. 182-188.

Ramakrishna, G., Pucha, R.V., Sitaraman, S.K., “Micro-scale Plasticity Effects in Microvia Reliability Analysis,” Proceedings of the 52nd Electronic Components and Technology Conference, 2002, pp. 1304 -1309.

Tunga, K., Pyland, J., Pucha, R.V., and Sitaraman, S.K., “Study on the Choice of Constitutive and Fatigue Models in Solder Joint Life Prediction,” Proceedings of the ASME International Mechanical Engineering Congress and Exposition, 2002, New Orleans, USA. IMECE2002/EPP-39676.

Pucha, R.V., Ramakrishna, G. and Sitaraman, S.K., “Mechanics Issues at Micro-scale Modeling of Electronic Packages,” Proceedings of the ASME International Mechanical Engineering Congress and Exposition, 2001, New York, USA. IMECE2001/EPP-24709.

Pyland, J., Pucha, R.V. and Sitaraman, S.K. “Effect of Underfill on BGA Reliability,” Proceedings of the 51st Electronic Components & Technology Conference, pp. 85-90.

Pyland, J., Pucha, R.V. and Sitaraman, S.K., “Effect of Underfill on BGA Reliability,” Proceedings of The International Symposium & Exhibition on Advanced Packaging Materials, 2001, pp. 354-359.

Raghunathan, R., Pucha, R.V. and Sitaraman, S.K. “Thermal Cycling Guidelines for Automotive, Computer, Portable, and Implantable Medical Device Applications,” Packaging of Electronic and Photonic Devices, 2000, ASME IMECE, EEP-Vol.28, pp. 51-62.

Pyland, J., Pucha, R.V. and Sitaraman, S.K., 2000, “Does Underfilling Enhance BGA Reliability,” Proceedings of the 3rd Electronic Packaging Technology Conference, Singapore, pp. 241-245.

 

List Last Updated: 2012